FAMOBS
Frequency Agile Microwave Bonding System
| Coordinatore | FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse 27C contact info |
| Nazionalità Coordinatore | Germany [DE] |
| Totale costo | 2˙322˙707 € |
| EC contributo | 1˙760˙220 € |
| Programma | FP7-SME
Specific Programme "Capacities": Research for the benefit of SMEs |
| Code Call | FP7-SME-2007-2 |
| Funding Scheme | BSG-SME-AG |
| Anno di inizio | 2008 |
| Periodo (anno-mese-giorno) | 2008-11-01 - 2012-10-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse 27C contact info |
DE (MUENCHEN) | coordinator | 83˙538.00 |
| 2 |
"CAMERA DI COMMERCIO, INDUSTRIA, ARTIGIANATO E AGRICOLTURA DI MILANO"
Organization address
address: VIA MERAVIGLI 9/B contact info |
IT (MILANO) | participant | 281˙878.25 |
| 3 |
National Micoelectronics Institute
Organization address
address: Geddes House Suite 41 contact info |
UK ("Livingstone, Kirkton North, West Lothien") | participant | 245˙776.00 |
| 4 |
RF. COM LIMITED
Organization address
address: GREENBANK ROAD 95 contact info |
UK (EDINBURGH) | participant | 186˙110.00 |
| 5 |
Ribler GmbH
Organization address
address: Plieninger Strasse 58 contact info |
DE (Stuttgart) | participant | 180˙168.00 |
| 6 |
KEPAR ELECTRONICA SA
Organization address
address: CALLE ALMENDRO MALPICA 59 contact info |
ES (ZARAGOZA) | participant | 179˙265.00 |
| 7 |
FRESHFIELD MICROWAVE SYSTEMS LIMITED
Organization address
address: MALDON ROAD 153A contact info |
UK (TIPTREE) | participant | 134˙109.00 |
| 8 |
ACI-ecoTec GmbH & Co. KG
Organization address
address: ALBRING 18 contact info |
DE (St. Georgen) | participant | 127˙976.05 |
| 9 |
SEHO SYSTEMS GMBH
Organization address
address: FRANKENSTRASSE 7 contact info |
DE (KREUZWERTHEIM) | participant | 115˙030.00 |
| 10 |
Mikrosystemtechnik Baden-Wuerttemberg e.V
Organization address
address: Emmy-Noether-strasse 2 contact info |
DE (Freiburg) | participant | 97˙555.00 |
| 11 |
ACI ECOTEC GMBH
Organization address
address: Albring 18 contact info |
DE (Zimmern ob Rottweil) | participant | 64˙900.95 |
| 12 |
Industrial Microwave Systems Ltd
Organization address
address: "Canonc Road, Canon Industrial Park, Old Wolverton 10" contact info |
UK (Milton Keynes) | participant | 34˙462.74 |
| 13 |
ASOCIATIA ROMANA PENTRU INDUSTRIA ELECTRONICA SI SOFTWARE
Organization address
address: "SERBOTA 1, BL. V19, AP.117" contact info |
RO (BUCURESTI 5) | participant | 24˙511.00 |
| 14 |
HERIOT-WATT UNIVERSITY
Organization address
address: Riccarton contact info |
UK (EDINBURGH) | participant | 3˙159.00 |
| 15 |
OSAUHING EESTI INNOVATSIOONI INSTITUUT
Organization address
address: SEPAPAJA 6 contact info |
EE (TALLINN) | participant | 1˙781.00 |
| 16 |
UNIVERSITY OF GREENWICH
Organization address
address: "Old Royal Naval College, Park Row, Greenwich" contact info |
UK (LONDON) | participant | 0.00 |
Mappa
Word cloud
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Obiettivo del progetto (Objective)
'The cost of packaging in microelectronics is around 30% of total production costs, but this is rising at an alarming rate due to the increasing consumer demand for smaller and smarter portable electronic devices. In micro-systems, the costs of packaging can be up to 80% of total production costs. Technological advances to reduce packaging costs are therefore of pivotal importance to maintain the competitive edge of assembly companies. Moreover, with the exodus of high volume packaging and assembly companies to low-wage countries such as China and India, the manufacturing industry in Europe needs to revitalise itself by encouraging design and innovation that will allow European companies to produce assembly equipment and materials of tomorrow that will feed into the Asian market. Our approach of using microwave technology in bonding has significant advantages over technologies made available in the market. In our approach we don’t need a closed microwave oven. Through the open design we can do the placement, alignment and curing at the same time. The use of this technology in reel-to-reel manufacturing will be possible. Due to the higher level of integration and signifcantly shorter cycle times this new technology will give European packaging companies a clear competitive advantage particularly over their US competitors. Quality of the bonds will be improved as well due to better selectivity and special designed materials as well as the precisely adaptable frequency of the microwave. It uses pulsed microwave sources and relies on the selection of a few resonant cavities frequencies that are jittered (mode hopping). The two characteristics permit not only the avoidance of electrical discharges through arcing, but also the accurate curing of the paste at the location of interest, i.e. at the interface between a die and the substrate for example in the case of DCA. The project is driven bei 6 SME-IAGs who want to create this clear competitive advantage for theirmembers.'
Introduzione (Teaser)
EU-funded scientists unveiled an innovative microwave system not to heat food, but for use in the semiconductor industry to improve materials bonding quality.
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