SEAL
Semiconductor Equipment Assessment Leveraging Innovation
| Coordinatore | FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse 27C contact info |
| Nazionalità Coordinatore | Germany [DE] |
| Totale costo | 14˙059˙075 € |
| EC contributo | 9˙099˙955 € |
| Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
| Code Call | FP7-ICT-2009-5 |
| Funding Scheme | CP |
| Anno di inizio | 2010 |
| Periodo (anno-mese-giorno) | 2010-06-01 - 2013-09-30 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse 27C contact info |
DE (MUENCHEN) | coordinator | 0.00 |
| 2 |
ACP - ADVANCED CLEAN PRODUCTION GMBH
Organization address
address: RONTGENSTRASSE contact info |
DE (ESSLINGEN) | participant | 0.00 |
| 3 |
ADIXEN VACUUM PRODUCTS SAS
Organization address
address: AVENUE DE BROGNY contact info |
FR (ANNECY) | participant | 0.00 |
| 4 |
AMS AG
Organization address
address: TOBELBADERSTRASSE contact info |
AT (UNTERPREMSTAETTEN) | participant | 0.00 |
| 5 |
APPLIED MATERIALS ISRAEL LTD
Organization address
address: OPPENHEIMER contact info |
IL (REHOVOT) | participant | 0.00 |
| 6 |
COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Organization address
address: RUE LEBLANC contact info |
FR (PARIS 15) | participant | 0.00 |
| 7 |
FACHHOCHSCHULE WIENER NEUSTADT FUR WIRTSCHAFT UND TECHNIK GMBH
Organization address
address: JOHANNES GUTENBERGSTRASSE contact info |
AT (WIENER NEUSTADT) | participant | 0.00 |
| 8 |
Fries Research & Technology GmbH
Organization address
city: Bergisch Gladbach contact info |
DE (Bergisch Gladbach) | participant | 0.00 |
| 9 |
FUNDACIO PRIVADA INSTITUT CATALA DE NANOTECNOLOGIA
Organization address
address: CAMPUS DE LA UAB EDIFICI CM7 contact info |
ES (BELLATERRA (BARCELONA)) | participant | 0.00 |
| 10 |
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG
Organization address
address: Wilschdorfer Landstrasse contact info |
DE (Dresden) | participant | 0.00 |
| 11 |
HQ-Dielectrics GmbH
Organization address
address: Dornstadter Weg contact info |
DE (Dornstadt) | participant | 0.00 |
| 12 |
ICT Integrated Circuit Testing GmbH
Organization address
address: Ammerthalstrasse contact info |
DE (Heimstetten) | participant | 0.00 |
| 13 |
INFINEON TECHNOLOGIES AG
Organization address
address: Am Campeon 1-12 contact info |
DE (Neubiberg) | participant | 0.00 |
| 14 |
Intel Corporation
Organization address
address: ORANGE STREET contact info |
US (WILMINGTON NEW CASTLE DE) | participant | 0.00 |
| 15 |
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Organization address
address: Kapeldreef contact info |
BE (LEUVEN) | participant | 0.00 |
| 16 |
ION BEAM SERVICES
Organization address
address: RUE GASTON IMBERT PROLONGEE contact info |
FR (ROUSSET) | participant | 0.00 |
| 17 |
Jenoptik Automatisierungstechnik GmbH
Organization address
address: Konrad-Zuse-Strasse contact info |
DE (Jena) | participant | 0.00 |
| 18 |
KLA-TENCOR CORPORATION (ISRAEL)
Organization address
address: HATIKSHORET ST. contact info |
IL (MIGDAL HAEMEK) | participant | 0.00 |
| 19 |
MAPPER LITHOGRAPHY B.V.
Organization address
address: COMPUTERLAAN 15 contact info |
NL (DELFT) | participant | 0.00 |
| 20 |
MEMC ELECTRONIC MATERIALS SPA
Organization address
address: VIALE GHERZI contact info |
IT (NOVARA) | participant | 0.00 |
| 21 |
Metryx Ltd
Organization address
address: Unit 2 A, MANOR PARK, Nailsea Wall Lane contact info |
UK (Nailsea) | participant | 0.00 |
| 22 |
MICRON SEMICONDUCTOR ITALIA SRL
Organization address
address: VIA CAMILLO OLIVETTI contact info |
IT (AGRATE BRIANZA) | participant | 0.00 |
| 23 |
NANDA TECHNOLOGIES GMBH
Organization address
address: Lise-Meitner-Strasse contact info |
DE (Unterschleissheim) | participant | 0.00 |
| 24 |
Oxford Instruments GmbH
Organization address
address: Otto-von-Guericke Ring contact info |
DE (Wiesbaden) | participant | 0.00 |
| 25 |
Protec Carrier Systems GmbH
Organization address
address: Birlenbacher Strasse contact info |
DE (Siegen) | participant | 0.00 |
| 26 |
PVA TEPLA ANALYTICAL SYSTEMS GMBH
Organization address
address: Gartenstrasse contact info |
DE (Aalen) | participant | 0.00 |
| 27 |
Reinhardt Microtech AG
Organization address
address: Aeulistrasse contact info |
CH (Wangs) | participant | 0.00 |
| 28 |
SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG
Organization address
address: PRIELLE KORNELIA UTCA contact info |
HU (BUDAPEST) | participant | 0.00 |
| 29 |
SILTRONIC AG
Organization address
address: HANNS-SIEDEL-PLATZ contact info |
DE (MUENCHEN) | participant | 0.00 |
| 30 |
STMICROELECTRONICS CROLLES 2 SAS
Organization address
address: RUE JEAN MONNET 850 contact info |
FR (CROLLES) | participant | 0.00 |
| 31 |
SUSS MICROOPTICS SA
Organization address
address: RUE JAQUET DROZ contact info |
CH (NEUCHATEL) | participant | 0.00 |
| 32 |
SUSS MicroTec Lithography GmbH
Organization address
address: SCHLEISSHEIMER STRASSE contact info |
DE (GARCHING) | participant | 0.00 |
| 33 |
SUSS MicroTec Photomask Equipment GmbH & Co. KG
Organization address
address: Ferdinand-von-Steinbeis-Ring contact info |
DE (Sternenfels) | participant | 0.00 |
| 34 |
THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
Organization address
address: STATE STREET contact info |
US (ALBANY NY) | participant | 0.00 |
| 35 |
TOPPAN PHOTOMASKS FRANCE SAS
Organization address
address: ROUSSET PARC CLUB, AVENUE FRANCIS PERRIN contact info |
FR (ROUSSET) | participant | 0.00 |
Mappa
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Obiettivo del progetto (Objective)
SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment themes are equally spread amongst processing and metrology equipment, heading beyond the current state-of-the-art both for More Moore and More than Moore applications. The strategic objective of SEAL is to effectively combine efforts, resources and expertise in the joint assessment of novel equipment supported by cross-cut R&D dedicated to the identified needs of the assessment sub-projects.For Lithography, the key areas of illumination systems for mask aligners, EUV mask manufacturing and intelligent overlay management are addressed as well as massively parallel e-beam lithography. In addition, three important processes are addressed: low temperature oxidation, cleaning of sensitive interconnect stacks/structures and ion implantation for ultra shallow junctions and defect engineering. For metrology and analysis, the main focus is on enabling innovative systems to efficiently contribute to at-line and in-line monitoring and control within semiconductor facilities. Without such equipment, it will not be possible to validate progressively advanced processes during development and manufacturing.Cross-cut R&D activities relating to all equipment assessment sub-projects are covered including APC, model based control, equipment simulation, enhanced wafer and equipment logistics, advanced communication and man machine-interfaces, and virtual equipment engineering. A common approach for the assessment activities will be utilised with specifications that will be refined for each equipment type for the progressively emerging technology nodes.Overall, SEAL will strengthen the European equipment manufacturing industry in an ideal and sustainable way by combining advanced R&D topics in equipment sub-projects involving a wide community of users, research institutes and equipment suppliers with many SMEs.