ASPIS
Advanced Surface Protection for Improved Reliability PCB Systems
| Coordinatore | THE INSTITUTE OF CIRCUIT TECHNOLOGY LIMITED LBG
Organization address
address: Forestfield 25 contact info |
| Nazionalità Coordinatore | United Kingdom [UK] |
| Totale costo | 3˙011˙558 € |
| EC contributo | 2˙044˙167 € |
| Programma | FP7-SME
Specific Programme "Capacities": Research for the benefit of SMEs |
| Code Call | FP7-SME-2008-2 |
| Funding Scheme | BSG-SME-AG |
| Anno di inizio | 2010 |
| Periodo (anno-mese-giorno) | 2010-10-01 - 2013-09-30 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
THE INSTITUTE OF CIRCUIT TECHNOLOGY LIMITED LBG
Organization address
address: Forestfield 25 contact info |
UK (KELSO) | coordinator | 447˙167.00 |
| 2 |
EIPC SERVICES BV
Organization address
address: HERTOGSINGEL 49 B contact info |
NL (MAASTRICHT) | participant | 515˙000.00 |
| 3 |
GLOBAL INTERCONNECTION SERVICES VOF
Organization address
address: HUNZESTRAAT 138 contact info |
NL (HELMOND) | participant | 260˙000.00 |
| 4 |
Merlin Circuit Technology Ltd
Organization address
address: Sackville Road 39 contact info |
UK (Hove) | participant | 260˙000.00 |
| 5 |
SO.MA.CI.S. SPA
Organization address
address: VIA JESINA 17 contact info |
IT (CASTELFIDARDO AN) | participant | 205˙000.00 |
| 6 |
GRAPHIC PLC
Organization address
address: DOWN END LORDS MEADOW INDUSTRIAL contact info |
UK (CREDITON) | participant | 195˙000.00 |
| 7 |
ATOTECH DEUTSCHLAND GMBH
Organization address
address: ERASMUSSTRASSE 20-24 contact info |
DE (BERLIN) | participant | 162˙000.00 |
| 8 |
ITRI Innovation Ltd
Organization address
address: Unit 3 Curo Park contact info |
UK (St Albans) | participant | 0.00 |
| 9 |
NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO
Organization address
address: Schoemakerstraat 97 contact info |
NL (DEN HAAG) | participant | 0.00 |
| 10 |
UNIVERSITY OF LEICESTER
Organization address
address: University Road contact info |
UK (LEICESTER) | participant | 0.00 |
| 11 |
VALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECHNOLOGIJOS MOKSLU CENTRAS
Organization address
address: Savanoriu 231 contact info |
LT (VILNIUS) | participant | 0.00 |
Mappa
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Obiettivo del progetto (Objective)
'To investigate the scope, extent and factors causing black pad and related problems on printed circuit boards with an electroless nickel / immersion gold (ENIG) solderable finish . To develop a non-destructive test method to show the presence of black pad. To develop and test lower cost, less aggressive surface protection chemistries as replacements for conventional ENIG using both aqueous and ionic liquid based electrolytes. To introdude these to the European PCB industry and to support the introductiuon of new standards around their use.'
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