PALLAS

Organometallic Palladium(III) Polymer and Copolymer Assemblies for Superconductivity

 Coordinatore UNIVERSITE LYON 1 CLAUDE BERNARD 

 Organization address address: BOULEVARD DU 11 NOVEMBRE 1918 NUM43
city: VILLEURBANNE CEDEX
postcode: 69622

contact info
Titolo: Dr.
Nome: Javier
Cognome: Olaiz
Email: send email
Telefono: 33472697600
Fax: 33472697609

 Nazionalità Coordinatore France [FR]
 Totale costo 232˙676 €
 EC contributo 232˙676 €
 Programma FP7-PEOPLE
Specific programme "People" implementing the Seventh Framework Programme of the European Community for research, technological development and demonstration activities (2007 to 2013)
 Code Call FP7-PEOPLE-2010-IOF
 Funding Scheme MC-IOF
 Anno di inizio 2011
 Periodo (anno-mese-giorno) 2011-04-01   -   2014-03-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    UNIVERSITE LYON 1 CLAUDE BERNARD

 Organization address address: BOULEVARD DU 11 NOVEMBRE 1918 NUM43
city: VILLEURBANNE CEDEX
postcode: 69622

contact info
Titolo: Dr.
Nome: Javier
Cognome: Olaiz
Email: send email
Telefono: 33472697600
Fax: 33472697609

FR (VILLEURBANNE CEDEX) coordinator 232˙676.80

Mappa

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 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

organometallic    organic    bonds    display    conventional    backbone    pd    wires    superconductors    copolymers    stability    solubility    generation    ligand    stabilizing   

 Obiettivo del progetto (Objective)

'The main objective of the proposal is the synthesis of new one-dimensional Pd(III) nanowires constituted of a metallic core and of an organic shell. These wires are potential room-temperature superconductors. Two generations of wires can be identified. The first-generation wires display Pd(III)-Pd(III) bonds as a backbone and stabilizing conventional organic ligands: they are organometallic polymers and possess limited solubility and stability above -50°C. The second-generation wires also display Pd(III)-Pd(III) bonds as a backbone, but at least one stabilizing conventional ligand has been replaced by a polymer-functionalized ligand which will enhance both solubility and stability of the wires: they are organometallic copolymers. The possibility to access various morphologies with the new block copolymers should allow for targeting several applications, in fast digital circuits for example, as novel superconductors.'

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