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M3TERA

Micromachined terahertz systems -a new heterogeneous integration platform enabling the commercialization of the THz frequency spectrum

Total Cost €

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EC-Contrib. €

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Partnership

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 M3TERA project word cloud

Explore the words cloud of the M3TERA project. It provides you a very rough idea of what is the project "M3TERA" about.

manufacturing    career    scenario    wave    function    unprecedented    primary    industrial    internal    mobile    enabled    efficient    internet    driving    thz    accommodate    microsystems    initiate    countries    cell    transition    spread    microsystem    line    sensor    envisioned    commercialization    500    generations    society    company    links    professional    adaptive    ubiquitous    microwave    packaging    manufacturer    heavily    small    sensing    diagnosis    terahertz    link    food    manufactuable    compact    secondary    advancing    quality    integration    external    safety    provides    monitoring    track    density    space    m3tera    exceptional    speed    ericsson    station    environment    heterogeneous    micromachined    demonstration    ifat    medical    network    prototype    multiple    base    semiconductor    complete    ghz    frequency    business    sought    convergence    submillimeter    urban    envisions    volume    point    communication    industry    millimeter    reconfigurable    energy    roadmaps    platform   

Project "M3TERA" data sheet

The following table provides information about the project.

Coordinator
TECHNIKON FORSCHUNGS- UND PLANUNGSGESELLSCHAFT MBH 

Organization address
address: BURGPLATZ 3A
city: VILLACH
postcode: 9500
website: www.technikon.at

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Austria [AT]
 Project website https://m3tera.eu/
 Total cost 4˙255˙743 €
 EC max contribution 3˙742˙961 € (88%)
 Programme 1. H2020-EU.2.1.1.1. (A new generation of components and systems: Engineering of advanced embedded and energy and resource efficient components and systems)
 Code Call H2020-ICT-2014-1
 Funding Scheme RIA
 Starting year 2015
 Duration (year-month-day) from 2015-02-01   to  2018-10-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    TECHNIKON FORSCHUNGS- UND PLANUNGSGESELLSCHAFT MBH AT (VILLACH) coordinator 415˙875.00
2    KUNGLIGA TEKNISKA HOEGSKOLAN SE (STOCKHOLM) participant 987˙585.00
3    INFINEON TECHNOLOGIES AUSTRIA AG AT (VILLACH) participant 969˙062.00
4    CHALMERS TEKNISKA HOEGSKOLA AB SE (GOETEBORG) participant 681˙688.00
5    ERICSSON AB SE (STOCKHOLM) participant 612˙500.00
6    ANTERAL SL ES (SARRIGUREN NAVARRA) participant 76˙250.00
7    CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT CH (NEUCHATEL) participant 0.00

Map

 Project objective

This project envisions the wide-spread use of low-cost THz technology in our society, enabled by the proposed micromachined heterogeneous integration platform, which provides an unprecedented way to highly-integrated, volume-manufactuable, cost- and energy-efficient, reconfigurable submillimeter-wave and terahertz (THz) systems. The proposed THz integration platform is envisioned to initiate an important transition in industrial microwave-systems manufacturing and is expected to finally enable the large-scale commercialization of the heavily sought-after frequency space between 100 GHz and 1 THz. In line with technology convergence of advancing microwave semiconductor technology according to internal and external roadmaps, the proposed THz microsystem platform is envisioned to accommodate multiple generations of future THz products in different application fields. The concrete business and lead application case is THz microsystems enabling compact, low-cost point-to-point high-speed communication links in the frequency space between 100 GHz and 500 GHz, to be deployed in a scenario of a high-density small-cell base-station network providing ubiquitous high-speed internet access to mobile communication devices in urban environment. The key technology end-user driving the primary prototype development and demonstration of a complete THz communication link is Ericsson. A secondary prototype developed in M3TERA is on a multi-function adaptive THz sensor platform for different millimeter-wave sensing applications in society, including food quality control and food safety monitoring, medical diagnosis, and industrial sensing. The key manufacturing partner in this industry-driven proposal is the high-volume semiconductor and microsystems manufacturer IFAT, who also provides system packaging concepts. Project management of this 3-years project with 7 participants in 4 EU countries is done by a professional company with an exceptional career track in EU project management.

 Deliverables

List of deliverables.
Final Evaluation of the Telecom Prototype Documents, reports 2019-05-22 20:53:23
Prototype of Fabricated and Characterized Sensor Interface Demonstrators, pilots, prototypes 2019-05-22 20:53:22
THz Microsystem Prototypes for Telecom and THz Sensor Prototype Demonstrators, pilots, prototypes 2019-05-22 20:53:22
Data Management Plan (DMP) Open Research Data Pilot 2019-05-22 20:53:20
Project Quality Plan Other 2019-05-22 20:53:21
Risk Assessment Plan Documents, reports 2019-05-22 20:53:21
Internal and External IT Communication Infrastructure and Project Website Websites, patent fillings, videos etc. 2019-05-22 20:53:20
Report on Overall MMIC Concept and Intra-Platform Interfaces Documents, reports 2019-05-22 20:53:21

Take a look to the deliverables list in detail:  detailed list of M3TERA deliverables.

 Publications

year authors and title journal last update
List of publications.
2017 Ahmed Hassona, Vessen Vassilev, Zhongxia Simon He, Chiara Mariotti, Franz Dielacher, Herbert Zirath
Silicon Taper Based $D$ -Band Chip to Waveguide Interconnect for Millimeter-Wave Systems
published pages: 1092-1094, ISSN: 1531-1309, DOI: 10.1109/LMWC.2017.2763118
IEEE Microwave and Wireless Components Letters 27/12 2019-05-22
2016 Vorobyov, A.; Daskalaki, E.; Hennemann, C.; Decotignie, J.D.
Human Physical Condition RF Sensing at THz range
published pages: , ISSN: , DOI: 10.5281/zenodo.154031
Proceedings of 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society 2019-05-22
2018 Campion, James; Glubokov, Oleksandr; Gomez-Torrent, Adrian; Krivovitca, Aleksandr; Shah, Umer; Bolander, Lars; Li, Yinggang; Oberhammer, Joachim
An Ultra Low-Loss Silicon-Micromachined Waveguide Filter for D-Band Telecommunication Applications
published pages: , ISSN: , DOI: 10.5281/zenodo.1462754
2019-05-22
2018 Vorobyov, Alexander; Daskalaki, Eleni; Farserotu, John
Feasibility of Remote Vital Signs Sensing with a mm-Wave CW Reflectometer
published pages: , ISSN: , DOI: 10.5281/zenodo.1244160
IEEE 38th International Conference on ELECTRONICS AND NANOTECHNOLOGY (ELNANO-2018) 2019-05-22
2017 Bao, Mingquan; He, Zhongxia Simon; Zirath, Herbert
A 100-145 GHz Area-Efficient Power Amplifier in a 130 nm SiGe Technology
published pages: , ISSN: , DOI: 10.5281/zenodo.1041325
EuMW from 8th-13th October 2017 in Nürnberg/Germany 2019-05-22
2017 A. Martìnez; I. Maestrojuan; D. Valcazar; J. Teniente
High Gain Antenna for Sub-Milimeter Wave Communications
published pages: , ISSN: , DOI: 10.5281/zenodo.400150
European Microwave Week 2016 (EuMW 2016) 2019-05-22
2017 Carpenter, Sona; He, Zhongxia Simon; Zirath, Herbert
A Direct Carrier I/Q Modulator for High-Speed Communication at D-Band Using 130 nm SiGe BiCMOS Technology
published pages: , ISSN: , DOI: 10.5281/zenodo.1041330
EuMW from 8th-13th October 2017 in Nürnberg/Germany 2019-05-22
2017 Ahmed Hassona; Zhongxia Simon He; Chiara Mariotti; Franz Dielacher; Vessen Vassilev; Yinggang Li; Joachim Oberhammer; Herbert Zirath
A Non-galvanic D-band MMIC-to-Waveguide Transition Using eWLB Packaging Technology
published pages: , ISSN: , DOI: 10.5281/zenodo.815929
International Microwave Symposium 2017 (IMS 2017) 2019-05-22
2017 I. Maestrojuan; M. Goñi; A. Martinez
High Gain Reflector Antenna for M3tera H2020 Project
published pages: , ISSN: , DOI: 10.5281/zenodo.895924
IRMMW-THz 2017 conference 2019-05-22
2017 Campion, James; Shah, Umer; Oberhammer, Joachim
Elliptical Alignment Holes Enabling Accurate Direct Assembly of Microchips to Standard Waveguide Flanges at sub-THz Frequencies
published pages: , ISSN: , DOI: 10.5281/zenodo.896233
International Microwave Symposium 2017 (IMS 2017) 2019-05-22
2017 Seyedhosseinzadeh, Neda; Nabavi, Abdolreza; Carpenter, Sona; He, Zhongxia Simon; Bao, Mingquan; Zirath, Herbert
A SiGe High Gain and Highly Linear F-Band Single-Balanced Subharmonic Mixer
published pages: , ISSN: , DOI: 10.5281/zenodo.1041332
1 2019-05-22
2017 Seyedhosseinzadeh, Neda; Nabavi, Abdolreza; Carpenter, Sona; He, Zhongxia Simon; Bao, Mingquan; Zirath, Herbert
A 100-140 GHz SiGe-BiCMOS Sub-Harmonic Down-Converter Mixer
published pages: , ISSN: , DOI: 10.5281/zenodo.2267907
EuMW from 8th-13th October 2017 in Nürnberg/Germany 2019-05-22
2016 Vorobyov, A.; Daskalaki, E.; Hennemann, C.; Decotignie, J.D.
Human Physical Condition RF Sensing at THz range
published pages: , ISSN: , DOI: 10.5281/zenodo.154031
2019-05-22

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