Explore the words cloud of the M3TERA project. It provides you a very rough idea of what is the project "M3TERA" about.
The following table provides information about the project.
Coordinator |
TECHNIKON FORSCHUNGS- UND PLANUNGSGESELLSCHAFT MBH
Organization address contact info |
Coordinator Country | Austria [AT] |
Project website | https://m3tera.eu/ |
Total cost | 4˙255˙743 € |
EC max contribution | 3˙742˙961 € (88%) |
Programme |
1. H2020-EU.2.1.1.1. (A new generation of components and systems: Engineering of advanced embedded and energy and resource efficient components and systems) |
Code Call | H2020-ICT-2014-1 |
Funding Scheme | RIA |
Starting year | 2015 |
Duration (year-month-day) | from 2015-02-01 to 2018-10-31 |
Take a look of project's partnership.
# | ||||
---|---|---|---|---|
1 | TECHNIKON FORSCHUNGS- UND PLANUNGSGESELLSCHAFT MBH | AT (VILLACH) | coordinator | 415˙875.00 |
2 | KUNGLIGA TEKNISKA HOEGSKOLAN | SE (STOCKHOLM) | participant | 987˙585.00 |
3 | INFINEON TECHNOLOGIES AUSTRIA AG | AT (VILLACH) | participant | 969˙062.00 |
4 | CHALMERS TEKNISKA HOEGSKOLA AB | SE (GOETEBORG) | participant | 681˙688.00 |
5 | ERICSSON AB | SE (STOCKHOLM) | participant | 612˙500.00 |
6 | ANTERAL SL | ES (SARRIGUREN NAVARRA) | participant | 76˙250.00 |
7 | CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT | CH (NEUCHATEL) | participant | 0.00 |
This project envisions the wide-spread use of low-cost THz technology in our society, enabled by the proposed micromachined heterogeneous integration platform, which provides an unprecedented way to highly-integrated, volume-manufactuable, cost- and energy-efficient, reconfigurable submillimeter-wave and terahertz (THz) systems. The proposed THz integration platform is envisioned to initiate an important transition in industrial microwave-systems manufacturing and is expected to finally enable the large-scale commercialization of the heavily sought-after frequency space between 100 GHz and 1 THz. In line with technology convergence of advancing microwave semiconductor technology according to internal and external roadmaps, the proposed THz microsystem platform is envisioned to accommodate multiple generations of future THz products in different application fields. The concrete business and lead application case is THz microsystems enabling compact, low-cost point-to-point high-speed communication links in the frequency space between 100 GHz and 500 GHz, to be deployed in a scenario of a high-density small-cell base-station network providing ubiquitous high-speed internet access to mobile communication devices in urban environment. The key technology end-user driving the primary prototype development and demonstration of a complete THz communication link is Ericsson. A secondary prototype developed in M3TERA is on a multi-function adaptive THz sensor platform for different millimeter-wave sensing applications in society, including food quality control and food safety monitoring, medical diagnosis, and industrial sensing. The key manufacturing partner in this industry-driven proposal is the high-volume semiconductor and microsystems manufacturer IFAT, who also provides system packaging concepts. Project management of this 3-years project with 7 participants in 4 EU countries is done by a professional company with an exceptional career track in EU project management.
Final Evaluation of the Telecom Prototype | Documents, reports | 2019-05-22 20:53:23 |
Prototype of Fabricated and Characterized Sensor Interface | Demonstrators, pilots, prototypes | 2019-05-22 20:53:22 |
THz Microsystem Prototypes for Telecom and THz Sensor Prototype | Demonstrators, pilots, prototypes | 2019-05-22 20:53:22 |
Data Management Plan (DMP) | Open Research Data Pilot | 2019-05-22 20:53:20 |
Project Quality Plan | Other | 2019-05-22 20:53:21 |
Risk Assessment Plan | Documents, reports | 2019-05-22 20:53:21 |
Internal and External IT Communication Infrastructure and Project Website | Websites, patent fillings, videos etc. | 2019-05-22 20:53:20 |
Report on Overall MMIC Concept and Intra-Platform Interfaces | Documents, reports | 2019-05-22 20:53:21 |
Take a look to the deliverables list in detail: detailed list of M3TERA deliverables.
year | authors and title | journal | last update |
---|---|---|---|
2017 |
Ahmed Hassona, Vessen Vassilev, Zhongxia Simon He, Chiara Mariotti, Franz Dielacher, Herbert Zirath Silicon Taper Based $D$ -Band Chip to Waveguide Interconnect for Millimeter-Wave Systems published pages: 1092-1094, ISSN: 1531-1309, DOI: 10.1109/LMWC.2017.2763118 |
IEEE Microwave and Wireless Components Letters 27/12 | 2019-05-22 |
2016 |
Vorobyov, A.; Daskalaki, E.; Hennemann, C.; Decotignie, J.D. Human Physical Condition RF Sensing at THz range published pages: , ISSN: , DOI: 10.5281/zenodo.154031 |
Proceedings of 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society | 2019-05-22 |
2018 |
Campion, James; Glubokov, Oleksandr; Gomez-Torrent, Adrian; Krivovitca, Aleksandr; Shah, Umer; Bolander, Lars; Li, Yinggang; Oberhammer, Joachim An Ultra Low-Loss Silicon-Micromachined Waveguide Filter for D-Band Telecommunication Applications published pages: , ISSN: , DOI: 10.5281/zenodo.1462754 |
2019-05-22 | |
2018 |
Vorobyov, Alexander; Daskalaki, Eleni; Farserotu, John Feasibility of Remote Vital Signs Sensing with a mm-Wave CW Reflectometer published pages: , ISSN: , DOI: 10.5281/zenodo.1244160 |
IEEE 38th International Conference on ELECTRONICS AND NANOTECHNOLOGY (ELNANO-2018) | 2019-05-22 |
2017 |
Bao, Mingquan; He, Zhongxia Simon; Zirath, Herbert A 100-145 GHz Area-Efficient Power Amplifier in a 130 nm SiGe Technology published pages: , ISSN: , DOI: 10.5281/zenodo.1041325 |
EuMW from 8th-13th October 2017 in Nürnberg/Germany | 2019-05-22 |
2017 |
A. Martìnez; I. Maestrojuan; D. Valcazar; J. Teniente High Gain Antenna for Sub-Milimeter Wave Communications published pages: , ISSN: , DOI: 10.5281/zenodo.400150 |
European Microwave Week 2016 (EuMW 2016) | 2019-05-22 |
2017 |
Carpenter, Sona; He, Zhongxia Simon; Zirath, Herbert A Direct Carrier I/Q Modulator for High-Speed Communication at D-Band Using 130 nm SiGe BiCMOS Technology published pages: , ISSN: , DOI: 10.5281/zenodo.1041330 |
EuMW from 8th-13th October 2017 in Nürnberg/Germany | 2019-05-22 |
2017 |
Ahmed Hassona; Zhongxia Simon He; Chiara Mariotti; Franz Dielacher; Vessen Vassilev; Yinggang Li; Joachim Oberhammer; Herbert Zirath A Non-galvanic D-band MMIC-to-Waveguide Transition Using eWLB Packaging Technology published pages: , ISSN: , DOI: 10.5281/zenodo.815929 |
International Microwave Symposium 2017 (IMS 2017) | 2019-05-22 |
2017 |
I. Maestrojuan; M. Goñi; A. Martinez High Gain Reflector Antenna for M3tera H2020 Project published pages: , ISSN: , DOI: 10.5281/zenodo.895924 |
IRMMW-THz 2017 conference | 2019-05-22 |
2017 |
Campion, James; Shah, Umer; Oberhammer, Joachim Elliptical Alignment Holes Enabling Accurate Direct Assembly of Microchips to Standard Waveguide Flanges at sub-THz Frequencies published pages: , ISSN: , DOI: 10.5281/zenodo.896233 |
International Microwave Symposium 2017 (IMS 2017) | 2019-05-22 |
2017 |
Seyedhosseinzadeh, Neda; Nabavi, Abdolreza; Carpenter, Sona; He, Zhongxia Simon; Bao, Mingquan; Zirath, Herbert A SiGe High Gain and Highly Linear F-Band Single-Balanced Subharmonic Mixer published pages: , ISSN: , DOI: 10.5281/zenodo.1041332 |
1 | 2019-05-22 |
2017 |
Seyedhosseinzadeh, Neda; Nabavi, Abdolreza; Carpenter, Sona; He, Zhongxia Simon; Bao, Mingquan; Zirath, Herbert A 100-140 GHz SiGe-BiCMOS Sub-Harmonic Down-Converter Mixer published pages: , ISSN: , DOI: 10.5281/zenodo.2267907 |
EuMW from 8th-13th October 2017 in Nürnberg/Germany | 2019-05-22 |
2016 |
Vorobyov, A.; Daskalaki, E.; Hennemann, C.; Decotignie, J.D. Human Physical Condition RF Sensing at THz range published pages: , ISSN: , DOI: 10.5281/zenodo.154031 |
2019-05-22 |
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