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3D-LEAP SIGNED

3 Dimensional Light sEnsing for Advanced Portable Devices

Total Cost €

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EC-Contrib. €

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Partnership

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 3D-LEAP project word cloud

Explore the words cloud of the 3D-LEAP project. It provides you a very rough idea of what is the project "3D-LEAP" about.

overcome    acute    optics    disruptive    phones    global    images    public    3d    tvs    james    quality    changer    solution    device    meets    module    leadership    camera    lenses    introduce    owned    figure    wafer    sensing    adoption    imaging    shift    innovative    entry    mobile    lower    hardware    lack    difficult    productions    laptop    advantage    substrate    share    avatar    penetration    consistent    electronics    dimensional    image    containing    semiconductor    market    addressable    competitors    color    competitive    segments    pixels    cameras    cameron    small    mass    rules    hurdle    makers    filters    trying    creation    integrating    position    europe    players    mega    profitability    accelerate    reached    2d    structure    ipr    computers    privilege    movie    imagination    platforms    single    producing    technologies    hollywood    software    content    modules    sensors    modest    highest    barriers    tablets    captured    wlc    lens    professional    smart    household    hit    paradigm    micro    algorithms    mini   

Project "3D-LEAP" data sheet

The following table provides information about the project.

Coordinator
PHOTONIC SENSORS AND ALGORITHMS SL 

Organization address
address: CALLE GUARDIA CIVIL 23 ESC 2 10 38
city: VALENCIA
postcode: 46020
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Spain [ES]
 Project website http://www.photoniktech.com/
 Total cost 3˙468˙925 €
 EC max contribution 2˙428˙192 € (70%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
2. H2020-EU.2.3.1. (Mainstreaming SME support, especially through a dedicated instrument)
 Code Call H2020-SMEINST-2-2015
 Funding Scheme SME-2
 Starting year 2015
 Duration (year-month-day) from 2015-07-01   to  2018-03-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    PHOTONIC SENSORS AND ALGORITHMS SL ES (VALENCIA) coordinator 2˙428˙192.00

Map

 Project objective

This proposal aims to develop 3 Dimensional Mini-cameras (producing 3D-Images) for mobile phones, tablets and laptop computers; more specifically embedded camera modules providing 2D and 3D-Images, integrating sensing electronics and optics in a single lens Wafer Level Camera (WLC).

This market creating innovative device is aiming towards disruptive market-share and global leadership in 3D-imaging camera modules, to accelerate our growth, profitability and Europe´s competitive position in smart cameras for 3D-imaging. We introduce a paradigm changer by applying new sets of rules in one of the highest growth areas addressable in consumer technologies and, we will set entry barriers that are difficult to overcome for current and new market players; we will hit the market while established competitors will still be trying to figure out our algorithms, our IPR and our hardware/software solution.

Our most disruptive competitive advantage is based on our algorithms. These exploit a novel hardware structure described in detail in the proposal. In short, we build micro-lenses on top of a semiconductor substrate containing image sensors or pixels with several color filters. 3D has captured the public imagination through Hollywood mega productions (like James Cameron´s Avatar). It has reached modest market penetration in different segments including movie productions, household 3D-TVs and cameras with two lenses. The hurdle to mass market adoption of the technology is the lack of consistent quality 3D content. The paradigm shift that our market creating innovative 3D camera module enables is that it meets the need for much higher quality content production at a lower cost, and will enable the creation of high-quality consumer-owned 3D-content on mobile platforms. Today, 3D content creation is the privilege of a small number of professional movie makers.

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The information about "3D-LEAP" are provided by the European Opendata Portal: CORDIS opendata.

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