PICS

Photonic Integrated Circuits and Systems

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 Obiettivo del progetto (Objective)

'The main objectives of this project are to design and build novel photonic integrated circuits (PICs) that can be inserted into high-performance optical communications systems. PICs will be built for high capacity advanced modulation format telecommunications systems, for all-optical switching and routing, for microwave photonic systems, for free space lasers communications systems, and for biosensors. PICs combine more than one optical function on a single chip. The functions can be active functions such as optical signal generation, optical modulation, or photodetection, as well as passive functions such as optical signal routing or filtering. PICs provide a means for significantly reducing system size, weight and power, improving reliability, and increasing system performance and functionality. Traditionally optical systems are built from discrete components and the components are connected together using fiber connections. This is cumbersome in that each time light is coupled from a chip to an optical fiber, or from an optical fiber to a chip, signal power is reduced. This negatively impacts the system because each fiber connection is a potential failure point, and the devices must operate at higher levels to compensate for the optical losses. PICs can overcome these issues by connecting components on the chip using optical waveguides. They can realize novel system architectures employing advanced modulation formats where systems built from discrete components might be too complex and negatively impact size, weight, and power requirements. Additionally, when PICs are inserted into systems employing feedback networks, significantly higher bandwidth can be realized because of the lower feedback loop delays that are achievable. The novel devices and PICs that will be developed are intended to drastically improve the performance of systems for optical communications.'

Introduzione (Teaser)

Photonic integrated circuits come of age

Descrizione progetto (Article)

Many devices like amplifiers, multiplexers, de-multiplexers, lasers, attenuators and detectors can be integrated onto an integrated circuit (IC). In its electronic forms, the IC is now incredibly mature, but the same cannot be said for its photonic counterpart. That's partly because more than 95 % of electronic ICs are made with silicon, while different materials are employed for the fabrication of PICs.

This diversity in materials is diminishing the advantages that come with scaling. The prospect of large-scale integration with tens to hundreds of components integrated on a single chip motivated the 'Photonic integrated circuits and systems' (PICS) project. Researchers leveraged the existing manufacturing base to develop new types of ICs.

At the Scuola Superiore Sant'Anna in Pisa, Italy, the necessary infrastructure to conduct leading-edge research into photonic devices and PICs was built. This included simulation software for designing photonics components, materials required for the fabrication of PICs and more importantly, a clean room outfitted with state-of-the-art equipment. Through the PICS project, good working relationships were also established with experts from the industry and academia.

A common theme of the research conducted within the PICS project was development and characterisation of photonics devices for applications in telecommunications networks. Among the results was a monolithic PIC enabling all-optical wavelength conversion and a multilevel transmitter covering various modulation formats. Tunable chip-scale optical transmitters and receivers were also developed to enhance network flexibility.

The PICS project was terminated early. However, a new centre for photonics technologies was introduced to fundamentally change the way applications based on PICs are developed. Engaged in partnership with related industries, the Scuola Superiore Sant'Anna will be actively involved in developing cost-effective PICs for various applications, providing Europe with a competitive advantage.