TETTRA

Towards Enhanced III-V Tunnel Transistors

 Coordinatore IBM RESEARCH GMBH 

 Organization address address: SAEUMERSTRASSE 4
city: RUESCHLIKON
postcode: 8803

contact info
Titolo: Dr.
Nome: Heike
Cognome: Riel
Email: send email
Telefono: +41 44 7248334
Fax: +41 44 7248956

 Nazionalità Coordinatore Switzerland [CH]
 Totale costo 184˙709 €
 EC contributo 184˙709 €
 Programma FP7-PEOPLE
Specific programme "People" implementing the Seventh Framework Programme of the European Community for research, technological development and demonstration activities (2007 to 2013)
 Code Call FP7-PEOPLE-2011-IEF
 Funding Scheme MC-IEF
 Anno di inizio 2012
 Periodo (anno-mese-giorno) 2012-04-01   -   2014-03-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    IBM RESEARCH GMBH

 Organization address address: SAEUMERSTRASSE 4
city: RUESCHLIKON
postcode: 8803

contact info
Titolo: Dr.
Nome: Heike
Cognome: Riel
Email: send email
Telefono: +41 44 7248334
Fax: +41 44 7248956

CH (RUESCHLIKON) coordinator 184˙709.40

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

electrical    power    nanowire    fets    materials    vertical    interface    investigations    oxide       transistors    nanowires       gasb    substrates    characterization    grown    fabrication    inxga    inas    heterostructure    xas    tunnel    performance   

 Obiettivo del progetto (Objective)

'Tunnel transistors are currently considered promising candidates for future low-power high performance information processing applications. The proposed project TETTRA – Towards Enhanced III-V Tunnel TRAnsistors – is dedicated to the fabrication and characterization of III-V nanowire tunnel field-effect transistors (FETs). III-V semiconductor heterostructure nanowires, grown on Si substrates by means of the selective-area-epitaxy method, serve as basis for the tunnel FETs. The project concentrates on n-type tunnel FETs and furthermore focuses on one specific realization with regard to the choice of materials involved; i.e. n-type tunnel FETs consisting of a p-type GaSb source, an InxGa1-xAs channel, and an n-type InAs drain. This sequence of III-V materials is grown in the form of vertical heterostructure nanowires directly on silicon substrates, with InAs being in contact with the substrate and GaSb forming the nanowire tip. The heterostructure nanowires are then processes into vertical, gate-all-around tunnel FETs. The fabrication of the nanowire heterostructure and the processing of the III-V nanowire tunnel represent one of two main objectives of the project. Investigations on the growth of GaSb on InxGa1-xAs, on the p-doping of GaSb, and on metal contacts to GaSb are preceding the tunnel FET fabrication. The second objective of the project comprises the electrical characterization of the nanowire-oxide interface properties and the electrical characterization of III-V tunnel FETs. For characterizing the nanowire-oxide interface properties two independent techniques will be employed: capacitance-voltage measurements and the charge-pumping technique. Both deliver the interface trap level density, Dit, and both have been demonstrated to be applicable to single nanowire capacitors and FETs, respectively. Characterization is complemented by detailed investigations of the electrical properties of the III-V nanowire tunnel FETs.'

Introduzione (Teaser)

Most modern computers are run with transistors, but they are now reaching their physical limits. An EU initiative looked into the power savings and performance enhancement of transistors.

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