NPLC-LED

IMMERSION COOLING OF SUSPENDED AND COATED NANO-PHOSPHOR PARTICLES FOR ENHANCED THERMAL AND OPTICAL EXTRACTION OF LIGHT EMITTING DIODES FOR GENERAL ILLUMINATION

Coordinatore	Ozyegin University    more  Organization address address: NISANTEPE MAH ORMAN SOK 13 city: ALEMDAG CEKMEKOY ISTANBUL postcode: 34794 contact info Titolo: Dr. Nome: Nilay Cognome: Papila Email: send email Telefono: +90 216 564 95 68 Fax: +90 216 564 90 57
Nazionalità Coordinatore	Turkey [TR]
Totale costo	100˙000 €
EC contributo	100˙000 €
Programma	FP7-PEOPLE Specific programme "People" implementing the Seventh Framework Programme of the European Community for research, technological development and demonstration activities (2007 to 2013)
Code Call	FP7-PEOPLE-2011-CIG
Funding Scheme	MC-CIG
Anno di inizio	2012
Periodo (anno-mese-giorno)	2012-06-01   -   2016-05-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	Ozyegin University  Organization address address: NISANTEPE MAH ORMAN SOK 13 city: ALEMDAG CEKMEKOY ISTANBUL postcode: 34794 contact info Titolo: Dr. Nome: Nilay Cognome: Papila Email: send email Telefono: +90 216 564 95 68 Fax: +90 216 564 90 57	TR (ALEMDAG CEKMEKOY ISTANBUL)	coordinator	100˙000.00

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 Obiettivo del progetto (Objective)

'The introduction of high brightness light emitting diodes (LEDs) with white light and monochromatic colors has allowed LED penetration into general illumination applications. The increased electrical currents used to drive these LEDs have resulted in high heat fluxes, often exceeding those for average silicon computer chips. The output of a typical HB LED is today over 100 lumens, achieved with heat fluxes in excess of 300 W/cm2. Thermal management is, thus, a critical technology for LED lighting. Much of the current LED thermal research and development is focusing on air cooling with heat sinks. While these approaches provide significant heat removal capability, they are constrained by the presence of multiple interface resistances and they cannot effectively address non-uniform chip temperatures and local phosphor hot spots. To overcome the limitations imposed by air cooling, this research will investigate the potential of direct liquid cooling to provide an additional thermal path for heat dissipated in the LEDs and phosphor layers. The introduction of topside liquid cooling with optically-transparent liquids is expected to dramatically reduce average chip temperatures and to improve the uniformity of chip and phosphor temperature, leading to higher light extraction efficiencies.'