EUROCIS

Platform for European CMOS Imagers - EUROCIS

Coordinatore	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW    more  Organization address address: Kapeldreef 75 city: LEUVEN postcode: 3001 contact info Titolo: Ms. Nome: Christine Cognome: Van Houtven Email: send email Telefono: 3216281613 Fax: 3216281812
Nazionalità Coordinatore	Belgium [BE]
Totale costo	2˙844˙010 €
EC contributo	1˙993˙216 €
Programma	FP7-SPACE Specific Programme "Cooperation": Space
Code Call	FP7-SPACE-2011-1
Funding Scheme	CP-FP
Anno di inizio	2011
Periodo (anno-mese-giorno)	2011-11-01   -   2014-10-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW  Organization address address: Kapeldreef 75 city: LEUVEN postcode: 3001 contact info Titolo: Ms. Nome: Christine Cognome: Van Houtven Email: send email Telefono: 3216281613 Fax: 3216281812	BE (LEUVEN)	coordinator	940˙060.00
2	Excico France  Organization address city: Gennevilliers postcode: 92230 contact info Titolo: Dr. Nome: Julien Cognome: Venturini Email: send email Telefono: +33 1 41 11 27 26	FR (Gennevilliers)	participant	493˙296.00
3	SELEX ES SPA  Organization address address: VIA PIEMONTE 60 city: ROMA postcode: 187 contact info Titolo: Mr. Nome: Giampaolo Cognome: Preti Email: send email Telefono: +39 055 8950 1 Fax: +39 055 8950 316	IT (ROMA)	participant	349˙900.00
4	NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO  Organization address address: Schoemakerstraat 97 city: DEN HAAG postcode: 2600 JA contact info Titolo: Mr. Nome: Bram Cognome: Hardenbol Email: send email Telefono: 31888666368 Fax: 31152692111	NL (DEN HAAG)	participant	209˙960.00
5	SELEX GALILEO SPA  Organization address address: Via Albert Einstein 35 city: CAMPI BISENZIO postcode: 50013 contact info Titolo: Mr. Nome: Stefano Alfredo Cognome: Pieraccini Email: send email Telefono: +39 055 8950 1 Fax: +39 055 8950 316	IT (CAMPI BISENZIO)	participant	0.00

Mappa

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 Obiettivo del progetto (Objective)

'The main goal of this project is the creation of a European supply chain for state-of-the art CMOS imagers. As identified by both ESA and the EC, there is a need for such a supply chain for CMOS imagers for space applications which uses solely European (and hence ITAR-free) sources. This goal will be realized using the proposed consortium as all partners have excellent know-how and track record in the expertise fields required. A second goal of the project is to push the performance of CMOS imagers and match the requirements for the (typically very demanding) space applications. Hence large area (much larger than commercial imagers) high sensitivity imagers will be developed using stitching technology and backside thinning. A key element here is the backside passivation process using laser annealing. The outcome of this project is a CMOS imager design and manufacturing platform that can be used by the space industry (ESA, CNES, satellite manufacturers, ... ) for their future space imager needs. However, it will as well serve (and will be open for) other high-end imager needs in e.g. medical or security applications.'

Introduzione (Teaser)

EU-funded scientists are developing a design and manufacturing platform to enable space applications of high-tech imaging systems. Consisting solely of European suppliers, it will be free of international trade restrictions.

Descrizione progetto (Article)

Image sensors transform captured light into a digital signal that, when viewed with appropriate technology, recreates the image. Complementary metal oxide semiconductor (CMOS) image sensors are rapidly gaining market ground as low-power, high-resolution devices. Both the European Space Agency (ESA) and the European Commission have identified a need for development of CMOS image sensors (CIS) for space applications using solely European sources (independent of International Traffic in Arms Regulations (ITAR)).

EU-funded scientists are now filling that need with the project 'Platform for European CMOS imagers' (EUROCIS). They are establishing the CIS design and manufacturing platform as well as pushing the frontiers of commercial technology to match the demanding requirements of space. Key to success is backside passivation using laser annealing (enhancement of chemical stability by heating and slow cooling). Other high-end applications such as those in biomedicine or security are sure to follow.

During the first 12 months, scientists developed the design specifications for a space detector likely to be needed in future missions and came up with the preliminary design. Components are currently being fabricated and, in parallel, processes including laser annealing of the backside junction are being optimised through experiments and modelling. The team is also evaluating the application of post-processing coatings to reduce reflection and enhance transmission on silicon surfaces.