Coordinatore | INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Organization address
address: Kapeldreef 75 contact info |
Nazionalità Coordinatore | Belgium [BE] |
Totale costo | 5˙528˙752 € |
EC contributo | 3˙717˙653 € |
Programma | FP7-ENERGY
Specific Programme "Cooperation": Energy |
Code Call | FP7-ENERGY-2010-1 |
Funding Scheme | CP |
Anno di inizio | 2010 |
Periodo (anno-mese-giorno) | 2010-10-01 - 2013-09-30 |
# | ||||
---|---|---|---|---|
1 |
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Organization address
address: Kapeldreef 75 contact info |
BE (LEUVEN) | coordinator | 1˙002˙505.00 |
2 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse 27C contact info |
DE (MUENCHEN) | participant | 752˙400.00 |
3 |
FUNDACAO DA FACULDADE DE CIENCIAS DA UNIVERSIDADE DE LISBOA
Organization address
address: CAMPO GRANDE EDIFICIO C1 PISO 3 contact info |
PT (LISBOA) | participant | 457˙923.00 |
4 |
ASSOCIATION POUR LA RECHERCHE ET LE DEVELOPPEMENT DES METHODES ET PROCESSUS INDUSTRIELS - ARMINES
Organization address
address: Boulevard Saint-Michel 60 contact info |
FR (PARIS) | participant | 358˙675.00 |
5 |
APPLIED MATERIALS ITALIA SRL
Organization address
address: VIA POSTUMIA OVEST 244 contact info |
IT (SAN BAGIO DI CALLALTA) | participant | 312˙700.00 |
6 |
DOW CORNING EUROPE SA
Organization address
address: Rue Jules Bordet Parc Industriel Zone C contact info |
BE (SENEFFE) | participant | 225˙000.00 |
7 |
SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG
Organization address
address: PRIELLE KORNELIA UTCA 2 contact info |
HU (BUDAPEST) | participant | 217˙350.00 |
8 |
Ferro GmbH
Organization address
address: Gutleutstrasse 215 contact info |
DE (Frankfurt) | participant | 175˙800.00 |
9 |
4PICO
Organization address
address: Jan Tinbergenstraat 4B contact info |
NL (Sint Oedenrode) | participant | 142˙700.00 |
10 |
FERRO (HOLLAND) BV
Organization address
address: ROER 266 contact info |
NL (CAPELLE AAN DEN IJSSEL) | participant | 72˙600.00 |
11 |
BOSCH REXROTH BV*
Organization address
address: KRUISBROEKSESTRAAT 1 contact info |
NL (BOXTEL) | participant | 0.00 |
Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.
'Since the silicon wafer still accounts for a substantial part of the cost of solar modules, reducing the silicon consumption per watt peak is one of the most effective ways of reducing the overall cost of PV systems. In this project we propose a methodology to produce a high-efficiency solar module with a very limited amount of Si. The methodology is based on two technologies: the first one for the fabrication of the solar wafers, the second one for the processing of this new material. For the fabrication of the ultra-thin solar wafers, a material, for instance a metallic material, with a high coefficient of thermal expansion, is deposited on the substrate at high temperature. The system is then cooled down, and the difference of thermal expansion induces some stress in the silicon substrate. When the stress exceeds the mechanical strength of silicon, a crack propagates parallel to the surface, and the top layer (which thickness reaches in this case around 50 µm) of silicon is detached from the parent substrate. The thin silicon layer and the metal layer are rolled due to some remaining stress. This stress can be annihilated by dipping the sample in a chemical bath. The processing of this material into a solar module is not trivial and the second technology developed in this project proposes to glue the ultra-thin wafer to a definitive glass superstrate. The Si material is then processed into a solar cell, and encapsulated into a module. The module and the solar cell process are integrated and are performed at low temperature (heterojunction-based interdigitated back contact) to be compatible with the glass thermo-mechanical properties. The project directly addresses a core issue of photovoltaic research and proposes an elegant, low-cost and very innovative solution to solve it.'
Researchers have found a way to make thinner and more efficient solar panels, and developed a relevant manufacturing process.
DEMONSTRATION OF HIGH PERFORMANCE PROCESSES AND EQUIPMENTS FOR THIN FILM SILICON PHOTOVOLTAIC MODULES PRODUCED WITH LOWER ENVIRONMENTAL IMPACT AND REDUCED COST AND MATERIAL USE
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