SUGAR

Silicon sUbstrates from an inteGrated Automated pRocess

 Coordinatore INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW 

 Organization address address: Kapeldreef 75
city: LEUVEN
postcode: 3001

contact info
Titolo: Ms.
Nome: Christine
Cognome: Van Houtven
Email: send email
Telefono: 3216281613
Fax: 3216281812

 Nazionalità Coordinatore Belgium [BE]
 Totale costo 5˙528˙752 €
 EC contributo 3˙717˙653 €
 Programma FP7-ENERGY
Specific Programme "Cooperation": Energy
 Code Call FP7-ENERGY-2010-1
 Funding Scheme CP
 Anno di inizio 2010
 Periodo (anno-mese-giorno) 2010-10-01   -   2013-09-30

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW

 Organization address address: Kapeldreef 75
city: LEUVEN
postcode: 3001

contact info
Titolo: Ms.
Nome: Christine
Cognome: Van Houtven
Email: send email
Telefono: 3216281613
Fax: 3216281812

BE (LEUVEN) coordinator 1˙002˙505.00
2    FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V

 Organization address address: Hansastrasse 27C
city: MUENCHEN
postcode: 80686

contact info
Titolo: Mr.
Nome: Walter
Cognome: Krause
Email: send email
Telefono: +49 89 12052713
Fax: +49 89 12057534

DE (MUENCHEN) participant 752˙400.00
3    FUNDACAO DA FACULDADE DE CIENCIAS DA UNIVERSIDADE DE LISBOA

 Organization address address: CAMPO GRANDE EDIFICIO C1 PISO 3
city: LISBOA
postcode: 1749016

contact info
Titolo: Ms.
Nome: Livia
Cognome: Moreira
Email: send email
Telefono: +351 217 500 448
Fax: +351 217 500 166

PT (LISBOA) participant 457˙923.00
4    ASSOCIATION POUR LA RECHERCHE ET LE DEVELOPPEMENT DES METHODES ET PROCESSUS INDUSTRIELS - ARMINES

 Organization address address: Boulevard Saint-Michel 60
city: PARIS
postcode: 75272

contact info
Titolo: Ms.
Nome: Florence
Cognome: Thepenier
Email: send email
Telefono: +33 1 40 51 93 85
Fax: +33 1 40 51 00 94

FR (PARIS) participant 358˙675.00
5    APPLIED MATERIALS ITALIA SRL

 Organization address address: VIA POSTUMIA OVEST 244
city: SAN BAGIO DI CALLALTA
postcode: 31048

contact info
Titolo: Dr.
Nome: Alessandra
Cognome: Paggin
Email: send email
Telefono: 390423000000
Fax: 390423000000

IT (SAN BAGIO DI CALLALTA) participant 312˙700.00
6    DOW CORNING EUROPE SA

 Organization address address: Rue Jules Bordet Parc Industriel Zone C
city: SENEFFE
postcode: 7180

contact info
Titolo: Dr.
Nome: Guy
Cognome: Beaucarne
Email: send email
Telefono: +32 64 88 92 94
Fax: +32 64 88 89 50

BE (SENEFFE) participant 225˙000.00
7    SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG

 Organization address address: PRIELLE KORNELIA UTCA 2
city: BUDAPEST
postcode: 1117

contact info
Titolo: Ms.
Nome: Anita
Cognome: Farkasinszki
Email: send email
Telefono: +36 1 382 4530
Fax: +36 1 382 4532

HU (BUDAPEST) participant 217˙350.00
8    Ferro GmbH

 Organization address address: Gutleutstrasse 215
city: Frankfurt
postcode: 60327

contact info
Titolo: Mr.
Nome: Matthias
Cognome: Metzner
Email: send email
Telefono: 496182000000
Fax: +496181 593071

DE (Frankfurt) participant 175˙800.00
9    4PICO

 Organization address address: Jan Tinbergenstraat 4B
city: Sint Oedenrode
postcode: 5491DC

contact info
Titolo: Mr.
Nome: Hendrik
Cognome: Postma
Email: send email
Telefono: 31413490708
Fax: 31413490835

NL (Sint Oedenrode) participant 142˙700.00
10    FERRO (HOLLAND) BV

 Organization address address: ROER 266
city: CAPELLE AAN DEN IJSSEL
postcode: 2908 MC

contact info
Titolo: Dr.
Nome: Harald
Cognome: Kerp
Email: send email
Telefono: +31 413 283372
Fax: +31 413 283369

NL (CAPELLE AAN DEN IJSSEL) participant 72˙600.00
11    BOSCH REXROTH BV*

 Organization address address: KRUISBROEKSESTRAAT 1
city: BOXTEL
postcode: 5281 RV

contact info
Titolo: Mr.
Nome: Ronald
Cognome: Suurd
Email: send email
Telefono: 31646147242
Fax: 31411651800

NL (BOXTEL) participant 0.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

reducing    solar    wafers    expansion    silicon    substrate    cell    proposes    thermal    wafer    then    mechanical    module    fabrication    layer    stress    ultra    glass    si    methodology    thin    material    temperature   

 Obiettivo del progetto (Objective)

'Since the silicon wafer still accounts for a substantial part of the cost of solar modules, reducing the silicon consumption per watt peak is one of the most effective ways of reducing the overall cost of PV systems. In this project we propose a methodology to produce a high-efficiency solar module with a very limited amount of Si. The methodology is based on two technologies: the first one for the fabrication of the solar wafers, the second one for the processing of this new material. For the fabrication of the ultra-thin solar wafers, a material, for instance a metallic material, with a high coefficient of thermal expansion, is deposited on the substrate at high temperature. The system is then cooled down, and the difference of thermal expansion induces some stress in the silicon substrate. When the stress exceeds the mechanical strength of silicon, a crack propagates parallel to the surface, and the top layer (which thickness reaches in this case around 50 µm) of silicon is detached from the parent substrate. The thin silicon layer and the metal layer are rolled due to some remaining stress. This stress can be annihilated by dipping the sample in a chemical bath. The processing of this material into a solar module is not trivial and the second technology developed in this project proposes to glue the ultra-thin wafer to a definitive glass superstrate. The Si material is then processed into a solar cell, and encapsulated into a module. The module and the solar cell process are integrated and are performed at low temperature (heterojunction-based interdigitated back contact) to be compatible with the glass thermo-mechanical properties. The project directly addresses a core issue of photovoltaic research and proposes an elegant, low-cost and very innovative solution to solve it.'

Introduzione (Teaser)

Researchers have found a way to make thinner and more efficient solar panels, and developed a relevant manufacturing process.

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