µTHALYS
Micro-Technologies and Heterogeneous Advanced Platforms for Implantable Medical Systems
| Coordinatore | KATHOLIEKE UNIVERSITEIT LEUVEN
Spiacenti, non ci sono informazioni su questo coordinatore. Contattare Fabio per maggiori infomrazioni, grazie. |
| Nazionalità Coordinatore | Belgium [BE] |
| Totale costo | 2˙452˙885 € |
| EC contributo | 2˙452˙885 € |
| Programma | FP7-IDEAS-ERC
Specific programme: "Ideas" implementing the Seventh Framework Programme of the European Community for research, technological development and demonstration activities (2007 to 2013) |
| Code Call | ERC-2013-ADG |
| Funding Scheme | ERC-AG |
| Anno di inizio | 2014 |
| Periodo (anno-mese-giorno) | 2014-03-01 - 2019-02-28 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
KATHOLIEKE UNIVERSITEIT LEUVEN
Organization address
address: Oude Markt 13 contact info |
BE (LEUVEN) | hostInstitution | 2˙452˙885.20 |
| 2 |
KATHOLIEKE UNIVERSITEIT LEUVEN
Organization address
address: Oude Markt 13 contact info |
BE (LEUVEN) | hostInstitution | 2˙452˙885.20 |
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Obiettivo del progetto (Objective)
'The μTHALYS project aims to create a technology platform that enables a next revolution by bringing microsystem technology to the next level in terms of integration, miniaturization and multifunctionality and applying this development to address pending needs in health care. Several breakthrough materials, basic concepts and fabrication techniques will be developed based on silicon or going far beyond silicon: At the wafer scale integration level, integration of advanced polymers (optics, conductive polymers, ionic polymer-metal composites) will be studied. These will be applied in several novel subminiature actuator and sensor devices with broad application potential, amongst which microfluidic systems, pressure sensing arrays, In order to come to complex 3D systems combining modalities as optics, microfluidics, actuators and electronics, advanced device level fabrication and hybrid assembly technologies will be studied as well. Furthermore, the methods for packaging implants (flex/stretch interconnect technology, advanced interposers,…) will be pushed far beyond the current state of the art. The adoption of soft, and even bioresorbable materials for packaging and interconnects will spectacularly improve the human-implant interface. Another important research line pursued is the study of ultra-low power electronics for medical implants: sensor interfacing, A/D conversion, signal processing, data communication and power transfer. These fundamental research activities will lead to many applied projects and valorization activities during and long afterwards the end of this grant. In the project itself, two main medical applications are targeted directly: a urinary pacemaker to prevent incontinence, and a new generation of implantable electrodes for neurology.'