µBGAS
A Novel System for the Production of World's First Micro Ball Grid Array (µBGA) Spheres for enabling the EU Electronics Industry to produce smaller electronics goods
| Coordinatore | KINGSTON COMPUTER CONSULTANCY LIMITED
Organization address
address: WORSHIP STREET, CRYSTAL GATE 28-30 contact info |
| Nazionalità Coordinatore | United Kingdom [UK] |
| Totale costo | 3˙924˙714 € |
| EC contributo | 3˙118˙500 € |
| Programma | FP7-SME
Specific Programme "Capacities": Research for the benefit of SMEs |
| Code Call | FP7-SME-2008-2 |
| Funding Scheme | BSG-SME-AG |
| Anno di inizio | 2010 |
| Periodo (anno-mese-giorno) | 2010-06-01 - 2013-05-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
KINGSTON COMPUTER CONSULTANCY LIMITED
Organization address
address: WORSHIP STREET, CRYSTAL GATE 28-30 contact info |
UK (LONDON) | coordinator | 238˙964.00 |
| 2 |
SURFACE MOUNT AND RELATED TECHNOLOGIES IRELAND LIMITED - SMART GROUP IRELAND
Organization address
address: FAIRVIEW AVENUE LOWER 1A contact info |
IE (FAIRVIEW-DUBLIN) | participant | 501˙211.50 |
| 3 |
SURFACE MOUNT AND RELATED TECHNOLOGIES LIMITED LBG - SMART GROUP
Organization address
address: Easton Street 85 contact info |
UK (High Wycombe) | participant | 436˙527.50 |
| 4 |
ASSOCIACAO PORTUGUESA DE EMPRESAS DE TECNOLOGIAS AMBIENTAIS - APEMETA
Organization address
address: AVENIDA DO CAMPO GRANDE 294 contact info |
PT (LISBOA) | participant | 423˙462.50 |
| 5 |
FEDERATION OF HELLENIC INFORMATION TECHNOLOGY AND COMMUNICATION ENTREPRISES
Organization address
address: FRANTZI 19 contact info |
EL (ATHINA) | participant | 410˙222.50 |
| 6 |
ASSOCIATION OF INFORMATION TECHNOLOGY COMPANIES OF NOTHERN GREECE
Organization address
address: TECHNOPOLIS THESSALONIKIS BUSINESS PARK BUILDING C2 contact info |
EL (THESSALONIKI) | participant | 384˙506.00 |
| 7 |
COMPUTERISED INFORMATION TECHNOLOGY LTD
Organization address
address: CENTURION COURT 4- 5 BRICK CLOSE KILN FARM contact info |
UK (MILTON KEYNES) | participant | 347˙250.00 |
| 8 |
AINOOUCHAOU PLIROFORIKI AE
Organization address
address: L KIPHISIAS 116 KAI DAVAKI 1 contact info |
EL (ATHINA) | participant | 100˙000.00 |
| 9 |
UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK
Organization address
address: Western Road contact info |
IE (CORK) | participant | 80˙000.00 |
| 10 |
SEMI EUROPE-GRENOBLE OFFICE
Organization address
city: GRENOBLE contact info |
FR (GRENOBLE) | participant | 71˙356.00 |
| 11 |
Semicon Sp. z.o.o.
Organization address
address: ZWOLENSKA 43/43A contact info |
PL (Warsaw) | participant | 60˙000.00 |
| 12 |
ABIS SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA SPK
Organization address
address: UL. KAMIENNA 17 contact info |
PL (RZASKA) | participant | 45˙000.00 |
| 13 |
BIZESP LTD
Organization address
address: OXFORD CENTRE FOR INNOVATION - MILL STREET contact info |
UK (OXFORD) | participant | 20˙000.00 |
Mappa
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Obiettivo del progetto (Objective)
'There is relentless consumer demand for electronics equipment offering miniaturisation with higher functionality (e.g. cell phones playing music and movies whilst also offering email/SMS/camera functions). The industry is therefore continuously aiming for increases in integrated circuit miniaturization, processor speeds and circuit densities. The resultant increasing numbers of ever finer features on the silicon chip, and the need to electrically connect to them has stretched conventional wired or leaded electronics interconnect technology to its limits. This trend of miniaturisation with higher functionality looks set to continue, requiring fundamental advances in device electrical interconnect and mounting technology. Ball Grid Arrays (BGAs) is a key technology that simultaneously addresses the requirements for high density fine feature electrical interconnect and physical attachment of silicon chip devices. BGA is a 2-D array of miniature solder alloy spheres under the silicon chip that provides both electrical connection and mechanical attachment to a mounting socket or circuit board. The small diameter of the solder alloy spheres reduces electrical resistance and capacitance and helps to preserve electrical signal integrity. BGA technology facilitates a reduction in the silicon chip package size, better heat dissipation, and greater module (circuit) densities. Typical mobile phones and laptops contain 3,000 and 6,000 BGAs respectively. These BGAs are inside CPU, RAM, DSP, Memory sticks, Consumer electronic etc. The μBGAS project aims at wider SME companies who are interested in the development of novel production techniques for producing μBGAs of less than 150μm. The μBGAs system is targeted at all electronic product producing SME companies where miniaturisation is a major concern. This includes electronics for aerospace, automotive, mobile phones and laptops.'
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