Coordinatore | UNIVERSITAET SIEGEN
Organization address
address: HERRENGARTEN 3 contact info |
Nazionalità Coordinatore | Germany [DE] |
Totale costo | 5˙156˙629 € |
EC contributo | 3˙650˙992 € |
Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
Code Call | FP7-ICT-2011-8 |
Funding Scheme | CP |
Anno di inizio | 2012 |
Periodo (anno-mese-giorno) | 2012-10-01 - 2015-09-30 |
# | ||||
---|---|---|---|---|
1 |
UNIVERSITAET SIEGEN
Organization address
address: HERRENGARTEN 3 contact info |
DE (SIEGEN) | coordinator | 0.00 |
2 |
ALMA MATER STUDIORUM-UNIVERSITA DI BOLOGNA
Organization address
address: Via Zamboni contact info |
IT (BOLOGNA) | participant | 0.00 |
3 |
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
Organization address
address: RUE MICHEL -ANGE contact info |
FR (PARIS) | participant | 0.00 |
4 |
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
Organization address
address: RUE MICHEL -ANGE contact info |
FR (PARIS) | participant | 0.00 |
5 |
CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LA NANOELETTRONICA
Organization address
address: VIA TOFFANO contact info |
IT (BOLOGNA) | participant | 0.00 |
6 |
IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK
Organization address
address: IM TECHNOLOGIEPARK contact info |
DE (FRANKFURT (ODER)) | participant | 0.00 |
7 |
INFINEON TECHNOLOGIES AG
Organization address
address: Am Campeon 1-12 contact info |
DE (Neubiberg) | participant | 0.00 |
8 |
Institut polytechnique de Bordeaux
Organization address
address: AV DU DOCTEUR ALBERT SCHWEITZER contact info |
FR (TALENCE) | participant | 0.00 |
9 |
KUNGLIGA TEKNISKA HOEGSKOLAN
Organization address
address: Valhallavaegen contact info |
SE (STOCKHOLM) | participant | 0.00 |
10 |
UNIVERSITA DEGLI STUDI DI UDINE
Organization address
address: VIA PALLADIO contact info |
IT (UDINE) | participant | 0.00 |
11 |
UNIVERSITA DI PISA
Organization address
address: Lungarno Pacinotti contact info |
IT (PISA) | participant | 0.00 |
12 |
UNIVERSITE DES SCIENCES ET TECHNOLOGIES DE LILLE - LILLE I
Organization address
address: CITE SCIENTIFIQUE contact info |
FR (VILLENEUVE D'ASCQ) | participant | 0.00 |
Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.
GRADE is a three-year STREP proposal focused on advanced RTD activities necessary to demonstrate the proof-of-concept of novel graphene-based electronic devices operating at terahertz (THz) frequencies. We propose two different concepts with specific advantages. Graphene field effect transistors (GFET) use graphene as a high-mobility transistor channel. Alternative 'graphene base transistors' (GBT) are novel hot-electron devices that use graphene sandwiched between two insulating layers, each in turn covered by a metal layer. Considering the unique high frequency characteristics of the GFET and the GBT, the consortium envisions innovative applications in communication, automotive, security and environmental monitoring. Low power wireless communication systems operating above 100Gbit/s or handheld portable THz sensor systems for detection of dangerous agents seem feasible with active devices operating in the THz regime. To be affordable for a broad range of consumers, THz devices must be scalable and integrated with silicon technology. GBTs and GFETs can fulfill this requirement. The proposed research enables the demonstration and assessment of these novel device concepts for future THz systems, and prepares their transition to semiconductor manufacturing.To achieve these goals, GRADE unites a powerful consortium:Four academic partners, two of them with a strong experimental background and excellent processing facilities, one focused on physics-based modelling and simulation and one specialized in compact modelling and circuit design.One research institute, which provides a professionally run pilot production clean room, state of the art processing and an entry point for graphene into manufacturing.One global semiconductor manufacturer willing to push their capabilities to enable the fabrication of integrated graphene RF circuits, including the integration on SiC and co-integration with pre-fabricated CMOS wafers.