NAPOLI

Nano Photonic Optical Link

 Coordinatore  

 Organization address address: DEN DOLECH 2
city: EINDHOVEN
postcode: 5612 AZ

contact info
Titolo: Mr.
Nome: Alfons
Cognome: Bruekers
Email: send email
Telefono: +31 40 247 5824

 Nazionalità Coordinatore Non specificata
 Totale costo 72˙916 €
 EC contributo 72˙916 €
 Programma FP7-PEOPLE
Specific programme "People" implementing the Seventh Framework Programme of the European Community for research, technological development and demonstration activities (2007 to 2013)
 Anno di inizio 2013
 Periodo (anno-mese-giorno) 2013-09-01   -   2016-07-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    TECHNISCHE UNIVERSITEIT EINDHOVEN

 Organization address address: DEN DOLECH 2
city: EINDHOVEN
postcode: 5612 AZ

contact info
Titolo: Mr.
Nome: Alfons
Cognome: Bruekers
Email: send email
Telefono: +31 40 247 5824

NL (EINDHOVEN) coordinator 72˙916.67

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

optical    interconnect    consumption    performance    footprint    rack    computers    first    chip    density    computing    power    overcome    interconnects    photonic    bottleneck    interconnection   

 Obiettivo del progetto (Objective)

'In today’s ware house sized computers the interconnection of individual processing cores is limiting the total system performance. Interconnects already take up about 50% of the systems power consumption and this value increases with system complexity. Optical interconnects are nowadays employed for rack-to-rack communication to overcome this “interconnect bottleneck” by reducing space requirements and power consumption. In the future, such optical technologies must penetrate deeper in the system design and be applied for chip-to-chip, or even on-chip interconnection to sustain the exponential growth of computer performance. New approaches are needed to meet the extreme requirements in integration density, power consumption and cost for optical interconnects in future high performance computers. By exploring the limits of miniaturization and energy efficiency in integrated active optical components we want to demonstrate a compact optical link and assess the potential of nanophotonic technology for integrated optical chip-to-chip or even on-chip interconnects. We will employ metallo-dielectric cavities to shrink the footprint of devices, which in turn will increase operation speed, reduce power consumption and allow efficient cooling of the highly integrated devices through the metal surfaces. We will develop a first waveguide coupled nanolaser, demonstrate optical detectors with record small footprint and demonstrate for the first time an optical interconnect that satisfies the requirements of future computing systems with respect to transmission density, power consumption and device size. The acquired techniques will directly contribute to the development of a photonic technology platform. Such innovations in photonic technology are essential to overcome the interconnect bottleneck and enable next generation computing technology.'

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