Coordinatore | STIFTELSEN SINTEF
Organization address
address: Forskningsveien, PO Box 124 Blindern 1 contact info |
Nazionalità Coordinatore | Norway [NO] |
Totale costo | 3˙783˙986 € |
EC contributo | 2˙850˙000 € |
Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
Code Call | FP7-ICT-2007-2 |
Funding Scheme | CP |
Anno di inizio | 2008 |
Periodo (anno-mese-giorno) | 2008-04-01 - 2011-09-30 |
# | ||||
---|---|---|---|---|
1 |
STIFTELSEN SINTEF
Organization address
address: Forskningsveien, PO Box 124 Blindern 1 contact info |
NO (Oslo) | coordinator | 0.00 |
2 |
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
Organization address
address: Rue Michel -Ange contact info |
FR (PARIS) | participant | 0.00 |
3 |
CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT
Organization address
address: Rue Jaquet-Droz contact info |
CH (NEUCHATEL) | participant | 0.00 |
4 |
ECOLE NATIONALE SUPERIEURE DE MECANIQUE ET DES MICROTECHNIQUES
Organization address
address: CHEMIN DE L EPITAPHE contact info |
FR (BESANCON CEDEX) | participant | 0.00 |
5 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse contact info |
DE (MUENCHEN) | participant | 0.00 |
6 |
HELIOTIS AG
Organization address
address: BADENERSTRASSE 569 contact info |
CH (ZUERICH) | participant | 0.00 |
7 |
IMMS INSTITUT FUER MIKROELEKTRONIK- UND MECHATRONIK-SYSTEME GMBH
Organization address
address: EHRENBERGSTRASSE 27 contact info |
DE (ILMENAU) | participant | 0.00 |
8 |
POLITECHNIKA WARSZAWSKA
Organization address
address: PLAC POLITECHNIKI contact info |
PL (WARSZAWA) | participant | 0.00 |
9 |
UNIVERSITE DE FRANCHE-COMTE
Organization address
address: CLAUDE GOUDIMEL 1 contact info |
FR (BESANCON) | participant | 0.00 |
Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.
SMARTIEHS develops a smart, high-speed, cost effective and flexible inspection system for production of Micro(Opto)ElectroMechanicalSystems (M(O)EMS). SMARTIEHS decreases the inspection time of a wafer by a factor of 100. It cuts production costs and shorten the time to market.nTo achieve this, SMARTIEHS develops an innovative measurement concept: a probing wafer consisting of an array of micro optical sensors is adapted to and aligned with the wafer under test. The design and production of the micro-optical interferometer array inspects 100 M(O)EMS structures within only one measurement cycle. A multifunctional approach of the measurement concept allows the inspection of passive and active parameters within one inspection system. A novel smart pixel detector array is developed.nSMARTIEHS provides a multifunctional design with two interferometer configurations; a low coherent interferometer and a laser interferometer. The project focuses on the measurement of shape and deformation, resonance frequency and vibration amplitude distribution.nThe SMARTIEHS technology will be validated and demonstrated with industrial end users.nThe work in SMARTIEHS will be organised in eight work packages: Project management, Inspection system design, Micro-optical interferometer system design, Micro-optical wafer production, Smart pixel camera development, inspection system integration, Inspection system test and validation, Exploitation and dissemination.nThe SMARTIEHS consortium has RTD partners and industrial users: SINTEF (low-coherence interferometry, micro optics), WUT (laser interferometry, micro optics), Fraunhofer (production of Diffractive Optical Elements), CNRS (production of refractive optics, micro lenses), CSEM (design and production of smart pixel detector arrays), Heliotis (exploitation), IMMS (macro design of the inspection system), and Techfab (end user and validation).nSMARTIEHS lasts 38 months and has a budget of 3,77M�. Requested EC contribution is 2,85 M�
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