HISTORIC

Heterogeneous InP on Silicon Technology for Optical Routing and LogIC

Coordinatore	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW    more  Organization address address: KAPELDREEF 75 75 city: LEUVEN postcode: 3001 contact info Titolo: Ms. Nome: Christine Cognome: Van Houtven Email: send email Telefono: +3216281 613 Fax: +3216281 812
Nazionalità Coordinatore	Belgium [BE]
Totale costo	3˙253˙835 €
EC contributo	2˙300˙000 €
Programma	FP7-ICT Specific Programme "Cooperation": Information and communication technologies
Code Call	FP7-ICT-2007-2
Funding Scheme	CP
Anno di inizio	2008
Periodo (anno-mese-giorno)	2008-07-01   -   2011-12-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW  Organization address address: KAPELDREEF 75 75 city: LEUVEN postcode: 3001 contact info Titolo: Ms. Nome: Christine Cognome: Van Houtven Email: send email Telefono: +3216281 613 Fax: +3216281 812	BE (LEUVEN)	coordinator	0.00
2	CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE  Organization address address: Rue Michel -Ange city: PARIS postcode: 75794 contact info Titolo: Mr. Nome: Laurent Cognome: Mallet Email: send email Telefono: +33 14 507 5260 Fax: +33 14 507 5335	FR (PARIS)	participant	0.00
3	IBM RESEARCH GMBH  Organization address address: SAEUMERSTRASSE city: RUESCHLIKON postcode: 8803 contact info Titolo: Dr. Nome: Jan Bert Cognome: Offrein Email: send email Telefono: +41 44 7248572 Fax: +41 44 7248965	CH (RUESCHLIKON)	participant	0.00
4	TECHNISCHE UNIVERSITEIT EINDHOVEN  Organization address address: DEN DOLECH city: EINDHOVEN postcode: 5612 AZ contact info Titolo: Ms. Nome: S. (Suzanne) Cognome: Udo Email: send email Telefono: +31 40 2475824 Fax: +31 40 2459625	NL (EINDHOVEN)	participant	0.00

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 Obiettivo del progetto (Objective)

HISTORIC proposes to design, develop and test digital photonic integrated circuits containing a relatively large number of active photonic elements combined with passive elements, for use in e.g. all-optical packet switching for both datacom and telecom. The building blocks for the digital photonic circuits are ultra-compact gates based on micro-ring or micro-disk lasers, photonic crystal lasers or metallic nanocavity (or plasmonic) lasers. These lasers are fabricated making use of the heterogeneous integration of InP membranes on top of silicon on insulator passive optical circuits. Different approaches for the ultra compact lasers will be investigated, allowing to make use of the high precision growth and processing techniques available to the InP platform, as well as to take advantage of the extreme accuracy of state-of-the-art CMOS processing.nSeveral all-optical flip-flops and gates will be integrated on a single chip, and will be interconnected by short wire waveguides in the SOI structure. The extremely small dimensions of both the flip-flops, gates and their interconnections will result in a competitive footprint of optical packet switches as compared with electronic switches.nThe targetted ultra small dimensions of the laser-based all-optical flip-flops are expected to result in record low switching times and switching energies. Together with the low propagation losses in the SOI waveguides, this is expected to result in a competitive speed and power consumption of optical packet switches.nThe possibility of integrating a large number of photonic digital units together, as well as integrating them with compact passive optical routers such as AWGs, opens new perspectives for the design of integrated optical processors or optical buffers. The project will therefore also focus on designing new architectures for such optical processing or buffer chips. Extensive characterisation and system tests will demonstrate the advantage of the new optical approach.