FAB2ASM

Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly

Coordinatore	AALTO-KORKEAKOULUSAATIO    more  Organization address address: OTAKAARI 1 city: ESPOO postcode: 2150 contact info Titolo: Dr. Nome: Quan Cognome: Zhou Email: send email Telefono: 358947000000 Fax: 358947000000
Nazionalità Coordinatore	Finland [FI]
Sito del progetto	http://www.fab2asm.eu
Totale costo	7˙053˙327 €
EC contributo	4˙733˙600 €
Programma	FP7-NMP Specific Programme "Cooperation": Nanosciences, Nanotechnologies, Materials and new Production Technologies
Code Call	FP7-2010-NMP-ICT-FoF
Funding Scheme	CP
Anno di inizio	2010
Periodo (anno-mese-giorno)	2010-05-01   -   2013-04-30

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	AALTO-KORKEAKOULUSAATIO  Organization address address: OTAKAARI 1 city: ESPOO postcode: 2150 contact info Titolo: Dr. Nome: Quan Cognome: Zhou Email: send email Telefono: 358947000000 Fax: 358947000000	FI (ESPOO)	coordinator	847˙537.06
2	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW  Organization address address: Kapeldreef 75 city: LEUVEN postcode: 3001 contact info Titolo: Ms. Nome: Christine Cognome: Van Houtven Email: send email Telefono: 3216281613 Fax: 3216281812	BE (LEUVEN)	participant	910˙304.06
3	NXP SEMICONDUCTORS NETHERLANDS BV  Organization address address: High Tech Campus 60 city: EINDHOVEN postcode: 5656 GA contact info Titolo: Ms. Nome: Amanda Cognome: Raats Email: send email Telefono: +31 40 2728258 Fax: +31 76 5210777	NL (EINDHOVEN)	participant	764˙440.00
4	EIDGENOESSISCHE MATERIALPRUEFUNGS- UND FORSCHUNGSANSTALT  Organization address address: Ueberlandstrasse 129 city: DUEBENDORF postcode: 8600 contact info Titolo: Dr. Nome: Johann Cognome: Michler Email: send email Telefono: +41 33 228 4605 Fax: +41 33 228 4490	CH (DUEBENDORF)	participant	488˙300.00
5	UNIVERSITEIT TWENTE  Organization address address: DRIENERLOLAAN 5 city: ENSCHEDE postcode: 7522 NB contact info Titolo: Prof. Nome: Albertus Cognome: Huis In 't Veld Email: send email Telefono: +31 53 489 2527 Fax: +31 53 489 3631	NL (ENSCHEDE)	participant	472˙097.25
6	UNIVERSITE DE FRANCHE-COMTE  Organization address address: CLAUDE GOUDIMEL 1 city: BESANCON postcode: 25030 contact info Titolo: Ms. Nome: Pauline Cognome: Fournier Email: send email Telefono: +33 381665814 Fax: +33 3 81 50 11 03	FR (BESANCON)	participant	468˙228.20
7	Beam Express S.A.  Organization address address: PARC SCIENTIFIQUE EPFL BATIMENT C city: LAUSANNE postcode: 1015 contact info Titolo: Mr. Nome: Jean-Claude Cognome: Charlier Email: send email Telefono: +41 21 693 8750 Fax: +41 21 693 8751	CH (LAUSANNE)	participant	430˙617.80
8	ALMA CONSULTING GROUP SAS  Organization address address: Domaine des Bois d'Houlbec city: HOULBEC COCHEREL postcode: 27120 contact info Titolo: Mrs. Nome: Emmanuelle Cognome: Bur Email: send email Telefono: +33 4 72 35 80 30 Fax: +33 4 72 35 80 31	FR (HOULBEC COCHEREL)	participant	169˙420.00
9	3D PLUS SA  Organization address address: RUE HELENE BOUCHER ZI 408 city: BUC postcode: 78530 contact info Titolo: Mr. Nome: Christian Cognome: Val Email: send email Telefono: +33 1 30 83 26 51 Fax: +33 1 39 56 25 89	FR (BUC)	participant	158˙664.00
10	STMICROELECTRONICS SRL  Organization address address: VIA C.OLIVETTI 2 city: AGRATE BRIANZA postcode: 20864 contact info Titolo: Dr. Nome: Cristina Cognome: Di Gesù Email: send email Telefono: 390957000000 Fax: 390957000000	IT (AGRATE BRIANZA)	participant	23˙991.62

Mappa

 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

 Obiettivo del progetto (Objective)

'FAB2ASM tackles a major problem in 3D integration that currently limits industrial take-up: high throughput and high accuracy 3D integration of miniaturized dies onto dies or substrates. This issue is extremely important for 3D integration of microelectronics and microsystems. 3D integration will take off in the next 5 years in all measures including total number of devices, the market share, as well as the density of the connections. The state-of-the-art integration technology for 3D microsystems relies on robotic pick-and-placing machines and machine vision, which cannot achieve simultaneously high-speed and high-precision. If high precision e.g. a micron is needed, either the cycle time of integration can be very long, from e.g. over ten seconds to minutes, or even not achievable. The objective of the FAB2ASM is to develop highly efficient and precise die-level component integration technology based on hybrid assembly technology that joins robotic tools and self-alignment and corresponding interfacing methods for multi-functional microsystems. In contrast to most explorative self-assembly technology developed to-date, FAB2ASM attempts to develop a highly industry relevant technology that reuses most of the industrial process steps, but on the other hand dramatically improves the performance of the integration process in the precision and efficiency chart. FAB2ASM will allow handling small (100 µm) and/or thin dies (20 µm), ultra high speed assembly (40,000 UPH), and flip-chip capabilities, while ensuring industry proven reliability. Led by AALTO, this consortium of 5 research centers and 4 industries (ST, NXP, BX, 3DPLUS) will join force to fulfil this urgent and important need of industry in 3D integration, and will demonstrate the merits in three industry led demonstrators: one manufacturing equipment demonstrator, one photonic IC demonstrator and 3D microelectronics demonstrator.'

Introduzione (Teaser)

Novel technology being developed and tested by EU-funded researchers should ensure fast and accurate manufacturing of microsystems. Exploitation is expected to reduce the need for outsourcing and boost EU competitiveness.