AGAPAC

Advanced GaN packaging

Coordinatore	THALES ALENIA SPACE FRANCE    more  Organization address city: TOULOUSE postcode: 31100 contact info Titolo: Mr. Nome: Olivier Cognome: Vendier Email: send email Telefono: 33534353637 Fax: 33534355491
Nazionalità Coordinatore	France [FR]
Sito del progetto	http://www.agapac.eu
Totale costo	2˙848˙830 €
EC contributo	1˙764˙628 €
Programma	FP7-SPACE Specific Programme "Cooperation": Space
Code Call	FP7-SPACE-2007-1
Funding Scheme	CP
Anno di inizio	2008
Periodo (anno-mese-giorno)	2008-10-01   -   2012-03-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	THALES ALENIA SPACE FRANCE  Organization address city: TOULOUSE postcode: 31100 contact info Titolo: Mr. Nome: Olivier Cognome: Vendier Email: send email Telefono: 33534353637 Fax: 33534355491	FR (TOULOUSE)	coordinator	0.00
2	CENTRE NATIONAL D'ETUDES SPATIALES - CNES  Organization address address: Place Maurice Quentin 2 city: PARIS postcode: 75039 contact info Titolo: Mr. Nome: Francis Cognome: Pressecq Email: send email Telefono: 33561274669 Fax: 33561274732	FR (PARIS)	participant	0.00
3	EGIDE  Organization address city: TRAPPES postcode: 78190 contact info Titolo: Mr. Nome: Philippe Cognome: Lussiez Email: send email Telefono: +33 1 30 68 81 20 Fax: +33 1 30 66 06 51	FR (TRAPPES)	participant	0.00
4	FUNDACION TECNALIA RESEARCH & INNOVATION  Organization address address: PARQUE TECNOLOGICO DE MIRAMON PASEO MIKELETEGI 2 city: DONOSTIA-SAN SEBASTIAN postcode: 20009 contact info Titolo: Ms. Nome: Ane Cognome: Irazustabarrena Murgiondo Email: send email Telefono: 34946430850 Fax: 34946460900	ES (DONOSTIA-SAN SEBASTIAN)	participant	0.00
5	PLANSEE SE  Organization address address: Metallwerk Planseestrasse 71 city: REUTTE postcode: 6600 contact info Titolo: Mr. Nome: Franz Cognome: Cermak Email: send email Telefono: 4356730000000 Fax: 435673000000	AT (REUTTE)	participant	0.00
6	UNITED MONOLITHIC SEMICONDUCTORS GMBH  Organization address address: WILHELM-RUNGE-STRASSE 11 city: ULM postcode: 89081 contact info Titolo: Dr. Nome: Klaus Cognome: Beilenhoff Email: send email Telefono: +49 731 505 3080 Fax: +49 731 505 3005	DE (ULM)	participant	0.00
7	UNIVERSITY OF BRISTOL  Organization address address: TYNDALL AVENUE SENATE HOUSE city: BRISTOL postcode: BS8 1TH contact info Titolo: Mr. Nome: Mike Cognome: Hobbs Email: send email Telefono: 441179000000 Fax: 441179000000	UK (BRISTOL)	participant	0.00

Mappa

 Word cloud

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 Obiettivo del progetto (Objective)

'On the very last months, the Gallium Nitride (GaN) technology has made a remarked breakthrough in the world of the microwave electronics with the announcement of commercially available transistors from 5W to 180W at microwave frequencies. Coming from major transistor industrial vendors from Japon but also from US, it let equipment manufacturers and especially the one from space think that time has come now for a rapid insertion into their systems. Outside the reliability and the European source concerns, these GaN power transistors will roughly increase power density by more than an order of magnitude for large devices (from 0.5 W/mm to 5 W/mm for space applications including deratings). The consequence will then directly impact the packaging technology for which the thermal resistance needs to be importantly reduced if the advantages obtained at die level want to remain at its highest at module and equipment level. To address this critical item for space satellite applications is the aim of the proposed project which is in the ESA roadmap [Ref. ESTEC/AC/418-20, ESA-IPC 2006] for GaN component strategy but not funded by ESA. The ESA funding is being mainly dedicated toward GaN transistor process optimization, reliability and industrialization. In this project, AGAPAC, which stands for “Advanced GaN Packaging”, we want to establish a space compatible European supply chain for packaging solution of GaN HEMTs and GaN MMICs by 2010. To realize this project objective, we have defined sub-objectives which directly relate to 7 workpackages targeting: This project will extend beyond state of the art for high thermal dissipation composite (up to 600 W/mK) either based onto diamond or carbon nano-fiber compatible with hybride micropackage manufacturing technologies. The challenge remains in developing a space compatible power micropackage able to withstand up to 100 W of dissipated power when standard same size micropackage are around 25 W.'

Introduzione (Teaser)

The European Space Agency (ESA) has adopted measures towards greater self-reliance and to becoming more competitive on a global scale.