XMEMS
Towards Cost-Efficient Flexible Heterogeneous Integration for Micro- and Nanosystem Fabrication
| Coordinatore | KUNGLIGA TEKNISKA HOEGSKOLAN
Spiacenti, non ci sono informazioni su questo coordinatore. Contattare Fabio per maggiori infomrazioni, grazie. |
| Nazionalità Coordinatore | Sweden [SE] |
| Totale costo | 2˙279˙800 € |
| EC contributo | 2˙279˙800 € |
| Programma | FP7-IDEAS-ERC
Specific programme: "Ideas" implementing the Seventh Framework Programme of the European Community for research, technological development and demonstration activities (2007 to 2013) |
| Code Call | ERC-2010-AdG_20100224 |
| Funding Scheme | ERC-AG |
| Anno di inizio | 2011 |
| Periodo (anno-mese-giorno) | 2011-03-01 - 2016-02-29 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
KUNGLIGA TEKNISKA HOEGSKOLAN
Organization address
address: Valhallavaegen 79 contact info |
SE (STOCKHOLM) | hostInstitution | 2˙279˙800.00 |
| 2 |
KUNGLIGA TEKNISKA HOEGSKOLAN
Organization address
address: Valhallavaegen 79 contact info |
SE (STOCKHOLM) | hostInstitution | 2˙279˙800.00 |
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Obiettivo del progetto (Objective)
'This proposal targets the development of flexible heterogeneous integration schemes for combining best-of-class materials, components and manufacturing methods into economically viable micro- and nanosystem (MEMS) solutions. Today, the IC industry drives the development of most micro- and nanofabrication technologies, which are characterized by standardized processes, very large production volumes of >10.000 wafers/month and enormous capital investments. In contrast, the vast majority of MEMS demand production volumes of <100 wafers/month and different manufacturing and integration processes for each type of device. The a-priori acceptance of IC manufacturing technologies for MEMS therefore leads to missed market opportunities for many moderate volume MEMS-based products and to sub-optimal material choices. Instead, we aim for a new MEMS-specific integration and manufacturing paradigm, in which the technologies and tools are adapted to the production volumes and design variations of MEMS devices. Specifically, we will develop novel and enabling micro/nano fabrication and integration techniques with a focus on flexibility and cost-efficiency in the following areas: ' Heterogeneous Material Integration, where we incorporate high-performance materials into MEMS using unconventional and innovative technologies and tools, including serial integration, wafer-level integration and free-form fabrication of MEMS; ' Heterogeneous System Integration, where we develop new wafer level schemes to combine, process and interconnect components fabricated with different technologies such as MEMS, NEMS, ICs or photonics; ' Lab-on-Chip Integration, in which transducers, mass transport solutions, surface biochemistry and liquids are combined at the wafer level into high-performance systems.'